This course consists of two lessons.
The first lesson describes the reliability of analog circuits. The reliability mechanisms of hot carrier injection (HCI), gate oxide integrity (GOI), time dependent dielectric breakdown (TDDB), negative bias temperature instability (NTBI), and electro migration (EM) are described and explained.
The second lesson includes the topics of reliability specifications, tools, and the design for reliability in analog circuits. Several examples are given to illustrate how to apply reliability design for analog circuits.